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.J Yuan, YF Qu, NK Deng, L Du, WB Hu*, XF Zhang, SL Wu, HX Wang.Three-dimensional numerical simulation of heat transfer enhancement of electronic devices by single crystal diamond rhombus-shaped pin fin microchannel heat sink,2024,143:110887
.NK Deng, YF Qu, J Yuan, WB Hu*, ZY Zhang, HX Wang.Thermal effect of Nd:YAG bonded on diamond by Mo/Au metal intermediate layer at room temperature,2024,147:114695
.NK Deng, YF Qu, J Yuan, Y Yuan, WB Hu*, SL Wu, HX Wang.Influence of Post-Bonding Annealing Treatment on Interface Characteristics of Si-Si Wafer Bonded via Room Temperature Surface Activation,2024
.ZC Xia, YR Wang, YW Peng, J Li, WB Hu, X Zhong, SL Wu.3D structure of box-and-grid electron multiplier with higher electron collection efficiency,2024,41(6):064205
.L Liu, J Li, KJ Ma, BY Liu, YZ Xue, WB Hu*, SL Wu, HQ Fan.Secondary electron emission enhancement of MgO-Au composite film by SiO2 doping in MgO surface layer,2023,355:135448

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