发布时间：2025-04-30

论文名称：Three-dimensional numerical simulation of heat transfer enhancement of electronic devices by single crystal diamond rhombus-shaped pin fin microchannel heat sink

发表刊物：Diamond and Realted Materials

合写作者：J Yuan, YF Qu, NK Deng, L Du, WB Hu*, XF Zhang, SL Wu, HX Wang

卷号：143

页面范围：110887

是否译文：否

发表时间：2024-03-25