发布时间：2025-04-30

论文名称：Influence of Post-Bonding Annealing Treatment on Interface Characteristics of Si-Si Wafer Bonded via Room Temperature Surface Activation

发表刊物：Journal of Materials Engieering and Performance

合写作者：NK Deng, YF Qu, J Yuan, Y Yuan, WB Hu*, SL Wu, HX Wang

是否译文：否

发表时间：2024-01-07