English

王晨

助理教授

个人信息更多+

电子邮箱：
学历：博士研究生毕业
办公地点：陕西省西安市长安区西安交通大学中国西部科技创新港校区
学位：博士
职称：助理教授

其他联系方式

邮箱：

移动电话：

通讯/办公地址：

邮编：

论文成果

当前位置：中文主页 - 科学研究 - 论文成果

Chen Wang.Qiyin Lin, Zongkun Pan, Jun Hong, Yicong Zhou.Thermal contact analysis of Flip-Chip package considering microscopic contacts of double-layer thermal interface materials[J],SCI,2024,356:122453
Chen Wang.Mingjun Qiu, Huijing Liu, Jun Hong, Feiyu Gu, Lifei Chen, Tao Wang, Hao Guan, Qiyin Lin.Experimental and numerical investigations on the bidirectional thermal contact performance[J],SCI,2025,73:106600
Chen Wang.Kaiyang Yin, Jun Hong, Qiyin Lin, Chun Yang.Optimized design of thermal conductivity characteristics of contact interface for enhanced thermal contact properties[J],SCI,2025,240:126635
Chen Wang.Feiyu Gu, Jun Hong, Qiyin Lin.Analysis of internal and external factors affecting thermal contact resistance from the perspective of entransy dissipation[J],SCI,2025,238:123469
Chen Wang.Qiyin Lin, Zongkun Pan, Jun Hong, Yicong Zhou.Effect of the secondary microcontact state induced by the all-factor thermal effect on bidirectional thermal contact performance[J],SCI,2023,142:106646
Chen Wang.Mingjun Qiu, Zongkun Pan, Kaiyi Zhou, Tao Wang, Jun Hong, Qiyin Lin.Optimized design of contact interfaces for enhanced heat dissipation in flip-chip package[J],SCI,2025,259:124936
Chen Wang.Qiyin Lin, Jun Hong, Yicong Zhou, Zongkun Pan.Effect of load application method on thermal contact resistance and uniformity of temperature distribution[J],SCI,2023,229:120625
Chen Wang.Qiyin Lin, Zongkun Pan, Jun Hong, Heng Shao, Yewen Mai.Optimization design method of material stiffness of contact interface considering surface roughness for improving thermal contact performance[J],SCI,2023,149:107131

共 8 条 1/1

首页上一页下一页尾页

加载更多