王晨
- Personal Information
- E-Mail: 74f69562ee4390748266700acab787ea7d0c6cf03c14954bccc143f6a5ef8a195dc2bbc6c4a85503f94304ec2b0a2762230d6dbe6eeafbc2afa20f84f875071031ada5d791d00a093378cf59d13fefac7eb21789a9d2a7457d68c910935622f4d9eb6f596874bc7ede20b919e43a28db2a136e37264b9731c4d573115a7072d0
- Education Level: With Certificate of Graduation for Doctorate Study
- Business Address: 陕西省西安市长安区西安交通大学中国西部科技创新港校区
- Contact Information: 5912ebca5e7f801b8e2078424bee309ccf3d60aeb8f12d4e3bd6c8e554685ac945b49107e37517140afce048519a9833f8eeaad05587cf9602dbb710c694eff282d696c668a75ca3d7fb2d5a508e01f802ef8e3433aa9cf9b465d9af1bc138a9c0decac9d5b6a990849b72a3746377ad9b2c828735b17a0438a166319d541f08
- Professional Title: 助理教授
- Status: Employed
- Alma Mater: 西安交通大学
- Have Any Overseas Experience: Yes
- Foreign Personnel or Not: No
- Chen Wang.Qiyin Lin, Zongkun Pan, Jun Hong, Yicong Zhou.Thermal contact analysis of Flip-Chip package considering microscopic contacts of double-layer thermal interface materials[J],SCI,2024,356:122453
- Chen Wang.Mingjun Qiu, Huijing Liu, Jun Hong, Feiyu Gu, Lifei Chen, Tao Wang, Hao Guan, Qiyin Lin.Experimental and numerical investigations on the bidirectional thermal contact performance[J],SCI,2025,73:106600
- Chen Wang.Kaiyang Yin, Jun Hong, Qiyin Lin, Chun Yang.Optimized design of thermal conductivity characteristics of contact interface for enhanced thermal contact properties[J],SCI,2025,240:126635
- Chen Wang.Feiyu Gu, Jun Hong, Qiyin Lin.Analysis of internal and external factors affecting thermal contact resistance from the perspective of entransy dissipation[J],SCI,2025,238:123469
- 一种提升装配界面接触热性能的界面导热系数分布优化设计方法及系统,PCT/CN2025/087133,PCT or foreign applications,2025-4-14,
- 一种提升装配界面接触热性能的界面导热系数分布优化设计方法及系统,2024115930469,Invent,2024-11-18,
- 一种接触热阻和热整流系数测试方法,202411593044X,Invent,2024-11-18,
- 一种提升装配界面接触热性能的界面软硬程度设计方法,2023104340618,Invent,2023-4-21,