王晨

Personal Information
E-Mail:
Education Level: With Certificate of Graduation for Doctorate Study
Business Address: 陕西省西安市长安区西安交通大学中国西部科技创新港校区
Contact Information:
Professional Title: 助理教授
Status: Employed
Alma Mater: 西安交通大学
Have Any Overseas Experience: Yes
Foreign Personnel or Not: No

Publications

Current position: Home > Scientific Research > Publications

Chen Wang.Qiyin Lin, Zongkun Pan, Jun Hong, Yicong Zhou.Thermal contact analysis of Flip-Chip package considering microscopic contacts of double-layer thermal interface materials[J],SCI,2024,356:122453
Chen Wang.Mingjun Qiu, Huijing Liu, Jun Hong, Feiyu Gu, Lifei Chen, Tao Wang, Hao Guan, Qiyin Lin.Experimental and numerical investigations on the bidirectional thermal contact performance[J],SCI,2025,73:106600
Chen Wang.Kaiyang Yin, Jun Hong, Qiyin Lin, Chun Yang.Optimized design of thermal conductivity characteristics of contact interface for enhanced thermal contact properties[J],SCI,2025,240:126635
Chen Wang.Feiyu Gu, Jun Hong, Qiyin Lin.Analysis of internal and external factors affecting thermal contact resistance from the perspective of entransy dissipation[J],SCI,2025,238:123469
Chen Wang.Qiyin Lin, Zongkun Pan, Jun Hong, Yicong Zhou.Effect of the secondary microcontact state induced by the all-factor thermal effect on bidirectional thermal contact performance[J],SCI,2023,142:106646
Chen Wang.Mingjun Qiu, Zongkun Pan, Kaiyi Zhou, Tao Wang, Jun Hong, Qiyin Lin.Optimized design of contact interfaces for enhanced heat dissipation in flip-chip package[J],SCI,2025,259:124936
Chen Wang.Qiyin Lin, Jun Hong, Yicong Zhou, Zongkun Pan.Effect of load application method on thermal contact resistance and uniformity of temperature distribution[J],SCI,2023,229:120625
Chen Wang.Qiyin Lin, Zongkun Pan, Jun Hong, Heng Shao, Yewen Mai.Optimization design method of material stiffness of contact interface considering surface roughness for improving thermal contact performance[J],SCI,2023,149:107131

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Publications

王晨