王晨
- Personal Information
- E-Mail: 74f69562ee4390748266700acab787ea7d0c6cf03c14954bccc143f6a5ef8a195dc2bbc6c4a85503f94304ec2b0a2762230d6dbe6eeafbc2afa20f84f875071031ada5d791d00a093378cf59d13fefac7eb21789a9d2a7457d68c910935622f4d9eb6f596874bc7ede20b919e43a28db2a136e37264b9731c4d573115a7072d0
- Education Level: With Certificate of Graduation for Doctorate Study
- Business Address: 陕西省西安市长安区西安交通大学中国西部科技创新港校区
- Contact Information: 5912ebca5e7f801b8e2078424bee309ccf3d60aeb8f12d4e3bd6c8e554685ac945b49107e37517140afce048519a9833f8eeaad05587cf9602dbb710c694eff282d696c668a75ca3d7fb2d5a508e01f802ef8e3433aa9cf9b465d9af1bc138a9c0decac9d5b6a990849b72a3746377ad9b2c828735b17a0438a166319d541f08
- Professional Title: 助理教授
- Status: Employed
- Alma Mater: 西安交通大学
- Have Any Overseas Experience: Yes
- Foreign Personnel or Not: No
Thermal contact analysis of Flip-Chip package considering microscopic contacts of double-layer thermal interface materials
Release Time:2026-01-16
Hits:
- Date:
- 2026-01-16
- Impact Factor:
- 11.0
- Title of Paper:
- Thermal contact analysis of Flip-Chip package considering microscopic contacts of double-layer thermal interface materials
- Journal:
- Applied Energy
- Co-author:
- Qiyin Lin, Zongkun Pan, Jun Hong, Yicong Zhou
- First Author:
- Chen Wang
- Correspondence Author:
- Qiyin Lin
- Document Type:
- J
- Volume:
- 356
- Page Number:
- 122453
- Translation or Not:
- No
- Date of Publication:
- 2024-02-15
- Included Journals:
- SCI
