发布时间：2025-04-30

论文名称：Room temperature bonding of GaN on diamond wafers by using Mo/Au nano-layer for high-power semiconductor devices

发表刊物：Scripta Materialia

摘要：a

合写作者：Kang Wang, Kun Ruan, Wenbo Hu*, Shengli Wu, Hongxing Wang

是否译文：否

发表时间：2019-08-24