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Numerical Simulation and Experimental Study on Resist Filling Behavior in UV-nanoimprint Lithography [J].

发布时间:2025-04-30
点击次数:
发布时间:
2025-04-30
论文名称:
Numerical Simulation and Experimental Study on Resist Filling Behavior in UV-nanoimprint Lithography [J].
发表刊物:
Procedia CIRP,
摘要:
Du J, Wei Z, Tang Y. Numerical Simulation and Experimental Study on Resist Filling Behavior in UV-nanoimprint Lithography [J]. Procedia CIRP, 2012, 3 (0): 203-208. (SCI:BDS14, EI: 20124415618267)
合写作者:
Du J, Wei Z, Tang Y.
卷号:
2012, 3 (0)
页面范围:
: 203-208.
是否译文:
发表时间:
2012-03-19