基于悬膜结构MEMS桥式钯合金氢气传感芯片及制备方法
Release Time:2025-04-30
Hits:
- Title:
- 基于悬膜结构MEMS桥式钯合金氢气传感芯片及制备方法
- Disigner of the Invention:
- 王海容;弓瑨;王朝晖;王瑞浩
- Type of Patent:
- Invent
- Application Number:
- CN202310249668.9
- Service Invention or Not:
- No
- Application Date:
- 2023-03-15
- Date:
- 2025-04-30
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