Date:

2025-04-30

Title of Paper:

Range Analysis of Thermal Stress and Optimal Design for Tungsten-Rhenium Thin Film Thermocouples Based on Ceramic Substrates.

Journal:

Sensors,

Co-author:

Zhang Zhongkai; Tian Bian*; Yu Qiuyue; Shi Peng; Lin Qijing; Zhao Na; Jing Weixuan; Jiang Zhuangde.

Translation or Not:

No

Date of Publication:

2017-05-23