Cohesive Zone Criterion for Cracking along the Cu/Si Interface in Nanoscale Components
发布时间：2025-04-30
点击次数：
- 发布时间：
- 2025-04-30
- 论文名称：
- Cohesive Zone Criterion for Cracking along the Cu/Si Interface in Nanoscale Components
- 发表刊物：
- Engineering Fracture Mechanics
- 摘要：
- Crack initiation and propagation along the Cu/Si interface in multilayered films (Si/Cu/SiN) with different thicknesses of the Cu layer (20 and 200 nm) are experimentally investigated using a nano-cantilever and millimeter-sized four-point bending specimens. To examine the cohesive zone model (CZM) criterion for interfacial delamination along the Cu/Si interface in nanoscale stress concentration, an exponential type of CZM is utilized to simulate the observed delamination processes using the finite element method. After the CZM parameters for the Cu/Si interface are calibrated by experiment, interface cracking in other experiments is predicted. This indicates that the CZM criterion is universally applicable for
describing cracking along the interface regardless of specimen dimensions and film thickness which include the differences in plastic behavior and residual stress. The CZM criterion
can also predict interfacial cracking along Cu/Si interfaces with different stress singularities.
- 合写作者：
- Y Yan, T Sumigawa, F Shang, T Kitamura
- 卷号：
- 78
- 页面范围：
- 2935-2946
- 是否译文：
- 否
- 发表时间：
- 2011-10-20