Reinvestigation of the effect of plasticity on delamination process of Si/Cu interface in a ductile nano-cantilever
发布时间:2025-04-30
点击次数:
- 发布时间:
- 2025-04-30
- 论文名称:
- Reinvestigation of the effect of plasticity on delamination process of Si/Cu interface in a ductile nano-cantilever
- 发表刊物:
- Int J Fracture
- 摘要:
- Reinvestigation of the effect of plasticity on delamination process of Si/Cu interface in a ductile nano-cantilever
- 合写作者:
- Pengfei Zhao, Fulin Shang, Yabin Yan
- 卷号:
- 161
- 页面范围:
- 65–78
- 是否译文:
- 否
- 发表时间:
- 2010-02-02
- 上一条:纳米材料力学行为的原子尺度模拟研究
- 下一条:PZT薄膜界面分层破坏的内聚力模拟




