Delamination test and the effect of free edge on interface strength
发布时间：2025-04-30
点击次数：
- 发布时间：
- 2025-04-30
- 论文名称：
- Delamination test and the effect of free edge on interface strength
- 发表刊物：
- Integrated Ferroelectrics
- 摘要：
- This paper studies the interfacial delamination resistance for weak interface between
piezoelectric PZT and metallic Cr thin films layers deposited on silicon substrate. An
experimental technique using sandwiched cantilever type specimen was developed to
measure the mechanical strength of the interface in thin films structures. To understand the
experimental data obtained, we proposed two delamination criteria for crack initiation that
are based on stress intensity concept and cohesive zone model, which accordingly provided
two parameters that describe the resistance to the interfacial delamination, i.e., stress intensity
factor Kd and the work of interface separation per unit area Γ0, respectively.
- 合写作者：
- F. Shang, T. Kitamura, H. Hirakata
- 卷号：
- 73(1)
- 页面范围：
- 67-74
- 是否译文：
- 否
- 发表时间：
- 2005-10-08