Papers
Release Time: 2025-04-30Hits:
- Date:2025-04-30
- Title of Paper:Delamination test and the effect of free edge on interface strength
- Journal:Integrated Ferroelectrics
- Summary:This paper studies the interfacial delamination resistance for weak interface between
piezoelectric PZT and metallic Cr thin films layers deposited on silicon substrate. An
experimental technique using sandwiched cantilever type specimen was developed to
measure the mechanical strength of the interface in thin films structures. To understand the
experimental data obtained, we proposed two delamination criteria for crack initiation that
are based on stress intensity concept and cohesive zone model, which accordingly provided
two parameters that describe the resistance to the interfacial delamination, i.e., stress intensity
factor Kd and the work of interface separation per unit area Γ0, respectively. - Co-author:F. Shang, T. Kitamura, H. Hirakata
- Volume:73(1)
- Page Number:67-74
- Translation or Not:No
- Date of Publication:2005-10-08
