Personal Information

[Basic Information]

Laili Wang, Professor and Doctoral Supervisor, Party Branch Secretary & Department Head of Industrial Automation Department,

School of Electrical Engineering, Xi'an Jiaotong University.

[Research Areas]

Research focuses on wide-bandgap semiconductor devices, packaging integration and power electronic conversion.

[Academic Awards]

Recipient of the National Science Fund for Distinguished Young Scholars, and Leader of Shaanxi Provincial Science and Technology Innovation Team.

Undertaken 10 national key projects and research topics;

published more than 340 papers in IEEE journals and conferences;

awarded 15 Best/Excellent Paper Awards by authoritative journals and major international conferences in the field.

[Academic Achievements]

First Prize for Technological Invention (1st Contributor), China Electrotechnical Society;

First Prize for Science and Technology Progress (1st Contributor), China Power Supply Society;

Gold Medal, Geneva International Exhibition of Inventions (1st Contributor);

Second Prize for Shaanxi Provincial Natural Science Award (1st Contributor);

First Prize for Science and Technology Award of Shaanxi Institutions of Higher Education (1st Contributor);

Outstanding Young Scholar Award, China Power Supply Society;

Outstanding Young Scientific and Technological Talent of China Electric Power Industry;

Shaanxi Provincial Youth Science and Technology Award;

Youth Science and Technology Award, China Electrotechnical Society;

Shaanxi "Three-Qin" Young Innovation Star.

[Other Achievements]

Served as Chair/Director or Vice Chair/Deputy Director in 8 branches of domestic and international academic organizations;

Associate Editor of 3 authoritative journals in the field of power electronics.

Organized 10 major domestic and international academic conferences, and delivered n invited presentations at conferences.

E-mail: llwang@mail.xjtu.edu.cn

Add: Xi’an Jiaotong University #28 Xianning West Road Xi’an, Shaanxi province, P.R.China

Zip Code: 710049

Wide Bandgap Power Semiconductors

• SiC Semiconductor, Ga₂O₃ Semiconductor

Power Packaging & Integration

• Low Parasitics High Thermal Conductive Packaging, High Temperature Packaging, High Voltage Packaging, Passive Integration, Hybrid Integration

High Density Power Conversion

• Soft-switching, Resonant network, Bi-directional converter, Synchronous Rectifier

Advanced Packaging and System

• 2.5D/3D Packaging, Multiphysics Analysis, Binding Technology

Reliability and Testing

• Failure Mechanism, Reliability Optimization, Intelligent Algorithm

Associate Editor of IEEE Transactions on Power Electronics (IEEE TPEL)

• Leads an emergency reviewing team with 50 reviewers to help clear the accumulated papers, which is very important to shorten the average reviewing time of the Journal

Associate Editor of IEEE Journal of Emerging and Selected Topics in Power Electronics (IEEE JESTPE)

Associate Editor of CPSS Transactions on Power Electronics and Applications (CPSS TPEA)

Guest Editor of the Special Issue “Power Integration with WBG Devices and Components” in IEEE JESTPE

Guest Associate Editor of the Special Compendium on “Wide Bandgap Power Semiconductors for the ITRW” in IEEE OJ-PEL