发布时间：2025-04-30

论文名称：Hybrid Double-Side Cooled Package for Multichip GaN Power Module With Optimal Current Sharing at High Switching Speed

发表刊物：IEEE Journal of Emerging and Selected Topics in Power Electronics

合写作者：B. Li, X. Yang, Y. Yao, K. Wang, L. Wang and W. Chen

是否译文：否

发表时间：2024-04-30