发布时间:2025-04-30
论文名称:A Novel Condition Monitoring Method for Full Modes of Package Degradation in High Power Modules Based on Hysteresis Curves of Forward Voltage Drop
发表刊物:IEEE Transactions on Power Electronics
合写作者:Yuchen Wang; Hong Zhang; Jianpeng Wang; Jin Zhang; Tianjian Wang; Yi Liu; Laili Wang; Yunqing Pei; Xiaoliang She; Jinjun Liu
是否译文:否
发表时间:2024-11-27
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