Hybrid Double-Side Cooled Package for Multichip GaN Power Module With Optimal Current Sharing at High Switching Speed
Release Time:2025-04-30
Hits:
- Date:
- 2025-04-30
- Title of Paper:
- Hybrid Double-Side Cooled Package for Multichip GaN Power Module With Optimal Current Sharing at High Switching Speed
- Journal:
- IEEE Journal of Emerging and Selected Topics in Power Electronics
- Co-author:
- B. Li, X. Yang, Y. Yao, K. Wang, L. Wang and W. Chen
- Translation or Not:
- No
- Date of Publication:
- 2024-04-30