新型高压碳化硅功率模块封装设计与优化
Release Time:2025-04-30
Hits:
- Project Name:
- 新型高压碳化硅功率模块封装设计与优化
- Status:
- 进行中
- Classification of Project:
- Vertical project
- Project Source:
- National Natural Science Foundation of China (NSFC)
- Project Number:
- 52211530090
- Date of Project Approval:
- 2022-06-01
- Date of Project Completion:
- 2024-05-01
- Date:
- 2025-04-30
- Prev One:新能源用薄膜电容关键技术研究及产业化
- Next One:碳化硅电力电子器件封装集成技术及其可靠性评估研究