碳化硅电力电子器件封装集成技术及其可靠性评估研究
Release Time:2025-04-30
Hits:
- Project Name:
- 碳化硅电力电子器件封装集成技术及其可靠性评估研究
- Status:
- 进行中
- Classification of Project:
- Horizontal Project
- Project Source:
- other
- Project Number:
- 202112249
- Date of Project Approval:
- 2021-12-01
- Date of Project Completion:
- 2024-09-01
- Subsidy Amount(Wan Yuan):
- 918.0
- Date:
- 2025-04-30
- Prev One:新型高压碳化硅功率模块封装设计与优化
- Next One:基于平面互连工艺的碳化硅功率模块电热特性建模研究