碳化硅功率模块新型封装与可靠性优化研究
Release Time:2025-04-30
Hits:
- Project Name:
- 碳化硅功率模块新型封装与可靠性优化研究
- Status:
- 进行中
- Classification of Project:
- Vertical project
- Project Source:
- National Key Technologies R&D Program
- Project Number:
- 2019YFE0122800
- Date of Project Approval:
- 2020-12-01
- Date of Project Completion:
- 2022-12-01
- Subsidy Amount(Wan Yuan):
- 272.0
- Date:
- 2025-04-30
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