基于烧结平面互联的新型高压碳化硅功率模块封装技术与失效机制研究
Release Time:2025-04-30
Hits:
- Project Name:
- 基于烧结平面互联的新型高压碳化硅功率模块封装技术与失效机制研究
- Status:
- 进行中
- Classification of Project:
- Vertical project
- Project Source:
- National Natural Science Foundation of China (NSFC)
- Project Number:
- U1966212
- Date of Project Approval:
- 2020-01-01
- Date of Project Completion:
- 2023-12-01
- Subsidy Amount(Wan Yuan):
- 336.88
- Date:
- 2025-04-30
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