耐高温硅隔离压阻力敏芯片的研究
Release Time:2025-04-30
Hits:
- Date:
- 2025-04-30
- Title of Paper:
- 耐高温硅隔离压阻力敏芯片的研究
- Journal:
- 西安交通大学学报
- Summary:
- EI
- Co-author:
- 赵立波，赵玉龙等
- Volume:
- 44(9)
- Page Number:
- 12-17
- Translation or Not:
- No
- Date of Publication:
- 2010-09-06