一种多孔微柱变曲率型面的芯片强化沸腾换热结构
Release Time:2025-04-30
Hits:
- Title:
- 一种多孔微柱变曲率型面的芯片强化沸腾换热结构
- Disigner of the Invention:
- 魏进家，薛艳芳
- Type of Patent:
- Invent
- Application Number:
- ZL 201210146854.1
- Service Invention or Not:
- No
- Application Date:
- 2014-12-10
- Date:
- 2025-04-30
- Prev One:一种复合式电子芯片冷却沸腾强化换热实验装置
- Next One:三段式尾流增速气垫船船体