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一种复合式电子芯片冷却沸腾强化换热实验装置

Release Time:2025-04-30
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Title:
一种复合式电子芯片冷却沸腾强化换热实验装置
Disigner of the Invention:
魏进家,张永海
Type of Patent:
Invent
Application Number:
ZL201310011110.3
Service Invention or Not:
No
Application Date:
2015-01-07
Date:
2025-04-30