一种复合式电子芯片冷却沸腾强化换热实验装置
Release Time:2025-04-30
Hits:
- Title:
- 一种复合式电子芯片冷却沸腾强化换热实验装置
- Disigner of the Invention:
- 魏进家,张永海
- Type of Patent:
- Invent
- Application Number:
- ZL201310011110.3
- Service Invention or Not:
- No
- Application Date:
- 2015-01-07
- Date:
- 2025-04-30
- Prev One:一种单次反射复合抛物面聚光器聚光的热电联产装置
- Next One:一种多孔微柱变曲率型面的芯片强化沸腾换热结构




