祝贺2023级硕士生李政撰写的论文在国际权威期刊 Applied Thermal Engineering 发表
- 发布时间：
- 2025-06-18
- 文章标题：
- 祝贺2023级硕士生李政撰写的论文在国际权威期刊 Applied Thermal Engineering 发表
- 内容：
2025年5月，2023级硕士生李政撰写的有关非均匀电极作用下的沸腾强化传热特性文章在国际权威期刊 Applied Thermal Engineering 发表。
论文详情如下：
Numerical simulation of pool boiling heat transfer on rib surfaces under non-uniform electric field
作者：Zheng Li , Zhenlin Zhou, Yongsheng Xu, Mei Lin,* Qiuwang Wang
期刊： Applied Thermal Engineering 273 (2025) 126511
DOI: 10.1016/j.applthermaleng.2025.126511
摘要：
Boiling heat transfer has become the primary method for dissipating heat from high-power electronic devices. However, the heat dissipation mechanism of boiling in high-voltage environments urgently needs improvement. In this study, a numerical calculation model coupling electrical, thermal, and ffuid ffelds was established. By customizing the electric ffeld force equation and employing the vapor–liquid phase change Lee model, four different electrode conffgurations were designed on the rib surface, each generating a distinct electric ffeld structure. Numerical simulations of boiling on rib surfaces with the four electrode arrangements under various voltage differences revealed that non-uniform electric ffelds are generated at the rib corners. Bubbles were observed to deviate from the strong ffeld region and escape to the weak ffeld region under the inffuence of the electric ffeld. This effect can disrupt the vapor fflm covering layer during the transition boiling or fflm boiling stages, thereby enhancing the boiling heat transfer capability and increasing the critical heat ffux. Within the voltage difference range of U = 25 ~ 75 kV, designing non-uniform electric ffelds could uniformly increase the heat ffux density on the rib surface, while also enhancing the critical heat ffux by 10.9 % to 35 %. This study provides theoretical support for the design of novel cooling systems and heat dissipation structures for highvoltage, high thermal power electronic devices.