Room temperature bonding of Si and Si wafers by using Mo/Au nano-adhesion layers
Release Time:2025-04-30
Hits:
- Date:
- 2025-04-30
- Title of Paper:
- Room temperature bonding of Si and Si wafers by using Mo/Au nano-adhesion layers
- Journal:
- Microelectronic Engineering
- Summary:
- aa
- Co-author:
- Kang Wang, Kun Ruan, Wenbo Hu*, Shengli Wu, Hongxing Wang
- Page Number:
- 1-6
- Translation or Not:
- No
- Date of Publication:
- 2019-05-27