硅凝胶－陶瓷基板－半导体芯片体系宽温域绝缘技术
Release Time:2025-10-16
Hits:
- Project Name:
- 硅凝胶－陶瓷基板－半导体芯片体系宽温域绝缘技术
- Status:
- 进行中
- Classification of Project:
- Vertical project
- Project Source:
- Smart Grid National Science and Technology Major Special Project Sub-project
- Project Number:
- 2025ZD0808704HZ
- Date of Project Approval:
- 2025-08-01
- Date of Project Completion:
- 2028-07-01
- Date:
- 2025-10-16
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