杨小平
- 副教授
- Supervisor of Master's Candidates
- E-Mail:
- Date of Employment:2018-07-24
- Education Level:With Certificate of Graduation for Doctorate Study
- Professional Title:副教授
- Status:Employed
- College:School Of Chemical Engineering And Technology
- Discipline:Power Engineering and Engineering Thermophysics
- Patents
一种协同驱动的高热流密度芯片相变散热装置和方法
Release Time:2025-04-30 Hits:
- Title:一种协同驱动的高热流密度芯片相变散热装置和方法
- Disigner of the Invention:杨小平;刘杰;魏进家;张永海
- Type of Patent:Invent
- Application Number:CN202011080127.0
- Service Invention or Not:No
- Application Date:2020-10-10
- Date:2025-04-30