Study on thermal elastic damping of micro-scale semiconductor beams
Release Time:2025-04-30
Hits:
- Date:
- 2025-04-30
- Title of Paper:
- Study on thermal elastic damping of micro-scale semiconductor beams
- Journal:
- Acta Mechanica
- Co-author:
- Shaofan Yang,Yaqin Song*, Sen Gu, Zhimin Hou
- Page Number:
- https://doi.org/10.1007/s00707-024-03957-4
- Translation or Not:
- No
- Date of Publication:
- 2024-05-19