铜基封装材料
Release Time:2025-10-16
Hits:
- Project Name:
- 铜基封装材料
- Status:
- 进行中
- Classification of Project:
- Horizontal Project
- Project Source:
- Shaanxi Provincial Natural Science Foundation University Joint Project - Key Project
- Project Number:
- 2021GXLH-Z-024
- Date of Project Approval:
- 2021-01-01
- Date of Project Completion:
- 2023-12-01
- Date:
- 2025-10-16
- Prev One:大吨位高强高导铜合金的纯净化绿色制造
- Next One:铜基封装材料