Enhancing interfacial thermal conductivity of copper-carbon nanotube array composite via metallic bonding: Molecular dynamics simulations
发布时间：2025-04-30
点击次数：
- 发布时间：
- 2025-04-30
- 论文名称：
- Enhancing interfacial thermal conductivity of copper-carbon nanotube array composite via metallic bonding: Molecular dynamics simulations
- 发表刊物：
- Chemical Physics
- 合写作者：
- Xin Wang, Xueliang Wang*, Yigang Tong, Yaping Wang
- 是否译文：
- 否
- 发表时间：
- 2024-05-22
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