Enhancing mechanism of interfacial metal element on the thermal transport across Cu-graphene interfaces revealed by molecular dynamics simulations
发布时间：2025-04-30
点击次数：
- 发布时间：
- 2025-04-30
- 论文名称：
- Enhancing mechanism of interfacial metal element on the thermal transport across Cu-graphene interfaces revealed by molecular dynamics simulations
- 发表刊物：
- Materials Today Communications
- 合写作者：
- Xin Wang, Xueliang Wang, Zhe Wang, Yongli Guo, Yaping Wang*
- 是否译文：
- 否
- 发表时间：
- 2020-07-07