Tuning thermal expansion coefficient of coppermultilayer graphene thermal management materials through tailoring interfacial microstructure
发布时间：2025-04-30
点击次数：
- 发布时间：
- 2025-04-30
- 论文名称：
- Tuning thermal expansion coefficient of coppermultilayer graphene thermal management materials through tailoring interfacial microstructure
- 发表刊物：
- Journal of Alloys and Compounds
- 摘要：
- This finding makes the Cu-MLG composite a promising candidate for applying in the thermal management of electronic packaging systems.
- 合写作者：
- Xueliang Wang, Yong Liu, Xin Wang, Yaping Wang, Tao Lai, Guofu Ren
- 卷号：
- 826
- 页面范围：
- 158709
- 是否译文：
- 否
- 发表时间：
- 2021-01-12