Papers
Release Time: 2025-04-30Hits:
- Date:2025-04-30
- Title of Paper:Enhancing interfacial thermal conductivity of copper-carbon nanotube array composite via metallic bonding: Molecular dynamics simulations
- Journal:Chemical Physics
- Co-author:Xin Wang, Xueliang Wang*, Yigang Tong, Yaping Wang
- Translation or Not:No
- Date of Publication:2024-05-22
- Prev One:Enhancing tribological performance of AA3003 aluminum alloy via adjusting surface wettability: Synergistic effects of chemical etching and modification
- Next One:Achieving triple improvements in intrinsic properties for porous flow field materials and the proton exchange membrane fuel cell electrochemical performance
