Papers
Release Time: 2025-04-30Hits:
- Date:2025-04-30
- Title of Paper:Tuning thermal expansion coefficient of coppermultilayer graphene thermal management materials through tailoring interfacial microstructure
- Journal:Journal of Alloys and Compounds
- Summary:This finding makes the Cu-MLG composite a promising candidate for applying in the thermal management of electronic packaging systems.
- Co-author:Xueliang Wang, Yong Liu, Xin Wang, Yaping Wang, Tao Lai, Guofu Ren
- Volume:826
- Page Number:158709
- Translation or Not:No
- Date of Publication:2021-01-12
