Date:

2025-04-30

Title of Paper:

Molecular dynamics simulation of thermoelastic coupling characteristic for low-dimensional nano-rod under thermal shock

Journal:

Advanced Materials Research

Summary:

In this paper, the thermoelastic problem of low-dimensional nano copper rod under
thermal shock is simulated using molecular dynamics method by adopting embedded atom method
potential function. The rod oriented along x-axis, the left edge of the rod is traction free and the
right edge is fixed, free boundary condition is imposed on y and z-axis. At the same time, the left
and right ends of the rod are imposed hot and cold bath respectively. By virtue of the molecular
dynamics method, the temperature, displacement and stress along the rod at different moment are
got. The results show that the temperature, displacement and stress distribution in the mobile region
are limited, indicating that the heat propagation speed is limited rather than infinite. In addition, the
simulation process are conducted the Large-scale Atomic / Molecular Massively Parallel simulator
(LAMMPS) and completed visualization software (Atomeye) in this paper

Co-author:

Ronghou Xia, Xiaogeng Tian, Yapeng Shen, et al

Volume:

581-582

Page Number:

444-447

Translation or Not:

No

Date of Publication:

2012-09-07