Date:

2025-04-30

Title of Paper:

MD simulation of a copper rod under thermal shock

Journal:

Acta Mechanica Sinica

Summary:

无

Co-author:

R. H. Xia, X. G. Tian and Y. P. Shen

Volume:

26(4)

Page Number:

599–604

Translation or Not:

No

Date of Publication:

2010-09-23