Range Analysis of Thermal Stress and Optimal Design for Tungsten-Rhenium Thin Film Thermocouples Based on Ceramic Substrates.
- 发布时间:2025-04-30
- 论文名称:Range Analysis of Thermal Stress and Optimal Design for Tungsten-Rhenium Thin Film Thermocouples Based on Ceramic Substrates.
- 发表刊物:Sensors,
- 合写作者:Zhang Zhongkai; Tian Bian*; Yu Qiuyue; Shi Peng; Lin Qijing; Zhao Na; Jing Weixuan; Jiang Zhuangde.
- 是否译文:否
- 发表时间:2017-05-23
- 合写作者:Zhang Zhongkai; Tian Bian*; Yu Qiuyue; Shi Peng; Lin Qijing; Zhao Na; Jing Weixuan; Jiang Zhuangde.