Papers
Release Time: 2025-04-30Hits:
- Date:2025-04-30
- Title of Paper:Thermal stresses analysis of a three-dimensional crack in a thermopiezoelectric solid
- Journal:Engineering Fracture Mechanics
- Summary:Thermal stresses analysis of a three-dimensional crack in a thermopiezoelectric solid
- Co-author:F. Shang, Z. Wang, Z. Li
- Volume:55(5)
- Page Number:737-750
- Translation or Not:No
- Date of Publication:1996-06-06
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