Papers
Release Time: 2025-04-30Hits:
- Date:2025-04-30
- Title of Paper:Thermal stress around a penny-shaped crack in a thermopiezoelectric solid
- Journal:Computational Materials Science
- Summary:The analytical solution for a penny-shaped crack subjected to uniform heat flow, in a thermopiezoelectric solid, is obtained in this paper. The exact expression of the stress-intensity factor is presented. The correctness of the derived solution is verified by the finite element results.
- Co-author:F Shang, M Kuna
- Volume:26
- Page Number:197-201
- Translation or Not:No
- Date of Publication:2003-10-10
