Preparation and Performance Characterization of Copper and Diamond Filled Composite Thermal Conductivity Materials
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发布时间：2025-04-30
发布时间：2025-04-30
论文名称：Preparation and Performance Characterization of Copper and Diamond Filled Composite Thermal Conductivity Materials
发表刊物：Microgravity Science and Technology
合写作者：Shuai Wang， Xiang Ma*，Quan Gao，Jinyu Wang，Na Xu*，Yonghai Zhang，Jinjia Wei，Jianfu Zhao，Bin Li
卷号：35(6)
页面范围：57
是否译文：否
发表时间：2023-10-23