Preparation and Performance Characterization of Copper and Diamond Filled Composite Thermal Conductivity Materials
Title of Paper:
Preparation and Performance Characterization of Copper and Diamond Filled Composite Thermal Conductivity Materials
Journal:
Microgravity Science and Technology
Co-author:
Shuai Wang, Xiang Ma*,Quan Gao,Jinyu Wang,Na Xu*,Yonghai Zhang,Jinjia Wei,Jianfu Zhao,Bin Li