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马祥
助理教授
Papers
Preparation and Performance Characterization of Copper and Diamond Filled Composite Thermal Conductivity Materials
Release Time:2025-04-30 Hits:
Date:
2025-04-30
Title of Paper:
Preparation and Performance Characterization of Copper and Diamond Filled Composite Thermal Conductivity Materials
Journal:
Microgravity Science and Technology
Co-author:
Shuai Wang, Xiang Ma*,Quan Gao,Jinyu Wang,Na Xu*,Yonghai Zhang,Jinjia Wei,Jianfu Zhao,Bin Li
Volume:
35(6)
Page Number:
57
Translation or Not:
No
Date of Publication:
2023-10-23

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