Login 中文
Personal Profile
To be updated...
马祥
助理教授
Papers
Jet impingement boiling heat transfer performance of refrigerant HP-1 in micro-pin-finned surfaces for high-power chips
Release Time:2025-04-30 Hits:
Date:
2025-04-30
Title of Paper:
Jet impingement boiling heat transfer performance of refrigerant HP-1 in micro-pin-finned surfaces for high-power chips
Journal:
International Journal of Heat and Mass Transfer
Co-author:
Xiang Ma, Liangxin Gui, Chengyu Hu, Gege Song, Xiaoping Yang, Yonghai Zhang*, Jinjia Wei
Volume:
221
Page Number:
125101
Translation or Not:
No
Date of Publication:
2023-12-18

Prev One:Flow boiling frictional pressure drop inside micro/mini-channels: A new general model and experimental investigation

Next One:Preparation and Performance Characterization of Copper and Diamond Filled Composite Thermal Conductivity Materials