A Novel Condition Monitoring Method for Full Modes of Package Degradation in High Power Modules Based on Hysteresis Curves of Forward Voltage Drop
Release Time:2025-04-30
Hits:
- Date:
- 2025-04-30
- Title of Paper:
- A Novel Condition Monitoring Method for Full Modes of Package Degradation in High Power Modules Based on Hysteresis Curves of Forward Voltage Drop
- Journal:
- IEEE Transactions on Power Electronics
- Co-author:
- Yuchen Wang; Hong Zhang; Jianpeng Wang; Jin Zhang; Tianjian Wang; Yi Liu; Laili Wang; Yunqing Pei; Xiaoliang She; Jinjun Liu
- Translation or Not:
- No
- Date of Publication:
- 2024-11-27