Near Junction Integration of Vapor Chamber for Transient Thermal Performance Improvements of SiC Power Module
Release Time:2025-04-30
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- Date:
- 2025-04-30
- Title of Paper:
- Near Junction Integration of Vapor Chamber for Transient Thermal Performance Improvements of SiC Power Module
- Journal:
- IEEE Open Journal of Power Electronics
- Co-author:
- W. Mu, Laili Wang et al.
- Volume:
- vol. 6
- Page Number:
- pp. 286-299,
- Translation or Not:
- No
- Date of Publication:
- 2025-01-13