Date:

2025-04-30

Title of Paper:

耐高温压阻力敏硅芯片及静电键合工艺

Journal:

北京理工大学学报

Summary:

(EI: 20114814563195)

Co-author:

赵立波，赵玉龙，热合曼•艾比布力等

Volume:

31(10)

Page Number:

1162-1167

Translation or Not:

No

Date of Publication:

2011-10-12