Patents

半导体断路开关二维流体模拟软件

Release Time:2025-04-30
Hits:
Title:
半导体断路开关二维流体模拟软件
Disigner of the Invention:
李永东 杨修东
Type of Patent:
Invent
Application Number:
2010SR031268
Service Invention or Not:
No
Application Date:
2010-06-26
Date:
2025-04-30