Enhancement of Flow-Jet Combined Boiling Heat Transfer of FC-72 Over Micro-Pin-Finned Surfaces
发布时间：2025-04-30
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- 发布时间：
- 2025-04-30
- 论文名称：
- Enhancement of Flow-Jet Combined Boiling Heat Transfer of FC-72 Over Micro-Pin-Finned Surfaces
- 发表刊物：
- Journal of Enhanced Heat Transfer
- 摘要：
- For highly efficient solving of the power dissipation problem of electronic components with high heat flux, experimental study of the flow-jet combined boiling heat transfer on silicon chips was conducted. Micro-pin-fins with dimensions of 3060 m2 and 30120 m2 (thickness height) were fabricated on the chip surfaces by the dry etching technique. The experiments were made at three different cross-flow velocities Vc (0.5, 1.0, 1.5 m/s) and different jet velocities Vj (0–2 m/s) with two liquid subcooling ∆Tsub (25◦C and 35◦C). A smooth surface was also tested for comparison. The micro-pin-fins showed a considerable heat transfer enhancement due to an increase in effective heat transfer surface area caused by micro-convection around micro-pin-fins. The maximum allowable heat flux qmax is increased and the wall superheat is decreased greatly. For a given Vc, the heat transfer enhancement is more significant as Vj increases, but the qmax increment decreases as Vc increases. The fin efficiency decreases as Vc or/and Vj increases or the heat flux q increases. The maximum qmax can reach 161 W/cm2 at Vc = 1.5 m/s, Vj = 2 m/s, ∆Tsub = 35◦C for chip PF30-120.
- 合写作者：
- Y. H. Zhang, J. J. Wei*, D. Guo
- 卷号：
- 19(6)
- 页面范围：
- 483-503
- 是否译文：
- 否
- 发表时间：
- 2012-12-10